JPS5285936A - Chemical plating solution - Google Patents

Chemical plating solution

Info

Publication number
JPS5285936A
JPS5285936A JP243876A JP243876A JPS5285936A JP S5285936 A JPS5285936 A JP S5285936A JP 243876 A JP243876 A JP 243876A JP 243876 A JP243876 A JP 243876A JP S5285936 A JPS5285936 A JP S5285936A
Authority
JP
Japan
Prior art keywords
plating solution
chemical plating
chemical
solution
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP243876A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5643109B2 (en]
Inventor
Kanji Murakami
Mineo Kawamoto
Mototsugu Kazushima
Yasusada Morishita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP243876A priority Critical patent/JPS5285936A/ja
Publication of JPS5285936A publication Critical patent/JPS5285936A/ja
Publication of JPS5643109B2 publication Critical patent/JPS5643109B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Chemically Coating (AREA)
JP243876A 1976-01-13 1976-01-13 Chemical plating solution Granted JPS5285936A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP243876A JPS5285936A (en) 1976-01-13 1976-01-13 Chemical plating solution

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP243876A JPS5285936A (en) 1976-01-13 1976-01-13 Chemical plating solution

Publications (2)

Publication Number Publication Date
JPS5285936A true JPS5285936A (en) 1977-07-16
JPS5643109B2 JPS5643109B2 (en]) 1981-10-09

Family

ID=11529263

Family Applications (1)

Application Number Title Priority Date Filing Date
JP243876A Granted JPS5285936A (en) 1976-01-13 1976-01-13 Chemical plating solution

Country Status (1)

Country Link
JP (1) JPS5285936A (en])

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6831009B2 (en) 2000-10-03 2004-12-14 Hitachi, Ltd. Wiring substrate and an electroless copper plating solution for providing interlayer connections
JP2023548732A (ja) * 2020-09-10 2023-11-21 パック テック－パッケージング テクノロジーズ ゲーエムベーハー 基板上に金属層を無電解成膜する方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4826630A (en]) * 1971-08-10 1973-04-07

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4826630A (en]) * 1971-08-10 1973-04-07

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6831009B2 (en) 2000-10-03 2004-12-14 Hitachi, Ltd. Wiring substrate and an electroless copper plating solution for providing interlayer connections
US6989329B2 (en) 2000-10-03 2006-01-24 Hitachi, Ltd. Method of manufacturing a wiring substrate and an electroless copper plating solution for providing interlayer connections
JP2023548732A (ja) * 2020-09-10 2023-11-21 パック テック－パッケージング テクノロジーズ ゲーエムベーハー 基板上に金属層を無電解成膜する方法

Also Published As

Publication number Publication date
JPS5643109B2 (en]) 1981-10-09

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